Heliotis 3D 白光干涉掃描儀
heliInspect H6
heliInspect™H6 3D 面型白光干涉儀量測
The heliInspetTM H6 可用於以下的3D量測
- 高度, 角度, 外形
- 外觀表面粗糙度, 波紋, 波浪狀起伏
- 瑕疵, 刮痕, 磨損
- 平整度, 共面性, 變形度
- 薄膜厚度 (斷層造影模式)
- 受益於Heliotis 長期專研於應用在工業上的3D sensor, H6 結合了精密的干涉儀與強大和高水平的影像處理能力。
系統整合商受益於H6堅固耐用且可靠的設計, 便於整合。H6適用於各種檢測任務，且可在諸如混合金屬/聚合物體等困難目標上產生可重複的結果。設備製造商受益於H6平台的模組化架構，可獲得精密的韌體功能，軟件開發套件和Heliotis的設計專業知識。標準功能可以透過客製化來擴展。（例如光學，CMOS image sensor，電子，FPGA，軟體，機械）
| Measurement head | industrial White-Light Interferometer compatible with exchangeable heliOptics™ WLI6 interferometer modules |
| Acquisition device | custom high-speed CMOS sensor with in-pixel signal processing |
| Light source | integrated high power LED (standard) or SLED (optional) |
| Dimensions (L x W x H) | 147 mm x 75 mm x 45 mm |
| Weight | 800 g (excluding WLI6) |
| Software | software development kits (SDK) for Halcon, LabView, C++, Python |
heliOptics™ WLI6
| Interferometer | Mirau | Mirau | Mirau | Michelson | Michelson | Michelson |
| field of view | 232 x 222 μm2 |
580 x 556 μm2 |
1.16 x 1.11 mm2 |
1.47 x 1.41 mm2 |
2.93 x 2.81 mm2 |
5.86 x 5.62 mm2 |
| working distance | 2.52 mm | 3.57 mm | 3.57 mm | 14.1 mm | 55.8 mm | 56.6 mm |
| WLI module | MIRAU-X50 | MIRAU-X20 | MIRAU-X10 | TG-R5 | TG-R10 | TG-R20 |
| numerical aperture | 0.5 | 0.4 | 0.3 | 0.17 | 0.11 | 0.07 |
| lateral resolution | 0.8 μm | 2 μm | 4 μm | 5 μm | 10 μm | 20 μm |
| resolution RMS (phase mode) |
50 nm (1 nm) |
70 nm (1 nm) |
100 nm (1 nm) |
100 nm (2 nm) |
100 nm (2 nm) |
100 nm (2 nm) |
| repeatability | 100 nm (2 nm in phase mode) | 100 nm (5 nm in phase mode) | ||||
| reflectivity of sample | < 0.1% to 100% | |||||