Heliotis 3D Industrial Camera
heliInspect™H8/H8M
heliInspect™ H8/H8M – Industrial WLI
Enhanced measurement capability
- topology measurement with reliable sub-micrometer resolution
- based on the latest 3D pixel sensor heliSens™ S4H
- unsurpassed measurement speed and resolution
- robust measurements thanks to high dynamic range
- Magnifications from 2x to 100x
Easy integration into the line
- standard GenICam Interface
- standard routines are already implemented on the camera
- integrated Z-scanner with 40 mm stroke, two resolutions 1 / 20 nm
- multiple configurations for cables and fastening
Software
- compatible with standard applications supporting GenICam
- heliSDK™ with examples for Halcon, C++, LabVIEW, Python
Application
| Measurement principle | White-Light Interferometer (industrial grade WLI) |
| Sensor | Heliotis lock-in imager heliSens™ S4/S4M, in-pixel signal processing |
| Camera board | FPGA based high-speed board, SOC, Linux OS, high-level interface through embedded heliService™ |
| Light source | High-power LED, lc = 630 nm |
| Scanner | Linear motor, precision guides, stroke = 40 mm, standard resolution = 20 nm, ultra resolution = 1 nm |
| Interfaces | GenCam / GigE, GIO, power (24V) |
| Software | heliSDK™ for C++, C#, Halcon, Matrox, LabVIEW, Python |
| heliOptics™ WLI8 | 2 x | 4 x | 8 x | 10 x | 20 x | 50 x | 100 x | |
| Field of view [mm2] | 6.5x 6.1 | 3.3x 3.1 | 1.6x 1.5 | 1.3x 1.2 | 0.65x 0. 61 | 0. 26x 0.25 | 0.13x 0.12 | |
| Optical resolution [µm] | H8 | 12 | 6 | 3 | 2.4 | 1.2 | 0.48 | 0.24(*) |
| H8M | 6 | 3 | 1.5 | 1.2 | 0.6 | 0.24(*) | 0.(*) | |
| Working distance [mm] | Michelson | 43.0 | 42.9 | 12.8 | ||||
| Nikon Mirau | 7.4 | 4.7 | 3.4 | 2.0 | ||||
| Leica Mirau | 3.6 | 3.6 | 2.5 | n.a. | ||||
| Numerical aperture | 0.1 | 0.15 | 0.25 | 0.3 | 0.4 | 0.5 | 0.7 | |
(*) pixel resolution
