heliInspectTM H3 - 3D Measurement Head
Metrology in Three Dimensions for Surfaces and Volumes
The new heliInspect™ H3 brings superior 3D metrology to the production floor. Equipped with heliotis’ latest 3D sensor heliSenseTM S3, this compact measurement module provides sub-micrometer surface analysis as well as true tomographic volume data.
The instrument utilizes heliotis’ proven parallel Optical Coherence Tomogra-phy principle and offers unmatched scan rates. Fast acquisition rates and a special design of the interferometer render vibration isolation obsolete.
The 3D vision module is engineered for high throughput and rough environ-ments. It is manufactured in Switzerland for long lasting reliability.
Applications
Features
Applications
3D sensor | patented smart pixel sensor heliSenseTM S3 with in-pixel signal processing of up to 1 million 2D-slices per second | ||
2D mode | live-view for navigation on sample (optional) | ||
Light source | standard: Superluminescent Light Emitting Diode (center = 840 nm, Poptical = 8 mW) options: high power LED, alignment laser |
||
field of view | 0.45 x 0.47 mm | 1.4 x 1.46 mm | 2.8 x 2.9 mm |
numerical aperture | 0.4 | 0.17 | 0.11 |
working distance | 2.8 mm | 18.1 mm | 22.7 mm |
Vertical resolution | 200 nm standard , 50 nm in phase mode | ||
Vertical scan speed | up to 50 mm per second | ||
Reflectivity of sample | < 0.1% to 100% |