Heliotis 3D 白光干涉掃描儀
heliCam C3 + WLI7
heliCam C3 - Fast Lock-in Camera
Lock-in相機最初是為低相干干涉測量而開發的，但是heliSenseTM S3的sensor和相機板已經在除OCT之外的各種應用中找到了新的機會，例如泵浦-探針光譜。為了便於整合，Heliotis的核心技術現在可作為精密相機使用，每秒可擷取和處理超過1百萬個2D影像。
- 超高精度感測器，水平解析度可達11µm 垂直解析度可達11nm
- 採用白光干涉原理，可進行透明與高反光物體的3D面掃描量測
- 內含FPGA晶片，量測速度快/li>
- 體積小，易於整合/li>
| Parameter | Value |
| Die Size | 19.71 mm x 16.89 mm |
| Number of Columns | 300, (center 280 usable, 2x10 columns are test columns) |
| Number of Rows | 300, (center 292 usable, 2x4 rows are test rows) |
| Total number of pixels | 90’000 |
| Column Pitch ΔXpixel | 39.6 μm |
| Row Pitch ΔYpixel | 39.6 μm |
| Photodiode dim. X ΔXphotodiode | 11 μm |
| Photodiode dim. Y ΔYphotodiode | 11 μm |
| Photodiode area | 121 μm2 |
| Optical fill factor | 9% for C3.1.1-CP-ML0 (without micro lenses) >50% for C3.1.1-CP-ML1 (with micro lenses) |
| Pixel Field Width | 11.9 mm |
| Pixel Field Height | 11.9 mm |
| Max. External Frame Rate | 3.8 kHz (2 x 10bit per frame) |
| Demodulation Frequency (standard firmware) | 2 - 250 kHz (equivalent to an internal frame rate of 8k - 1M fps) |
| Output Resolution | 10 bit |
| Quantum Efficiency η | 20-60% between 330 and 400 nm 60-80% between 400 and 720 nm 60-20% between 720 and 900 nm |